Degrees

• BS (Mat.Eng.) Seoul National University , Korea, 1984
• MS (Mat.Eng.) Seoul National University, Korea, 1986
• PhD (Mat.Eng.)Karlsruhe University & Forschungszentrum Karsruhe, Germany, 1991

Work Experience

• Visiting Professor, Pennsylvania State University, USA, July 2001 - July 2002
• Dean, College of Engineering, Kangnung National University, March 2004 - February 2006
• Visiting Professor, Korea University, Korea, September 2010 - August 2011
• Director, Gan

Research Interests

• Computer Simulation, Materials driven Design, Additive Manufacturing

Publications

• “A comparative study of dendritic growth by using the extended Cahn-Hilliard model and the conventional phase-field model”, Acta Mat. 84(2015)55-64
• “Effects of Ni3Sn4 and (Cu,Ni)6Sn5 intermetallic layers on cross-interaction between Pd and Ni in solder joints”, J.Alloys Comp. 579(2013)75
• "Effects of Pd(P) Thickness on the Microstructural Evolution Between Sn-3Ag-0.5Cu and Ni(P)/Pd(P)/Au Surface Finish During the Reflow Process", J.Elec.Mat. 41(2012)3348
• "Fast Concurrent Growth of Ni3Sn4 and Voids During Solid-State Reaction Between Sn-Rich Solder and Ni Substrates", J.Elec.Mat. 41(2012)44
• "Effect of Interfacial Compound Layer on Pd Resettlement during Reflow and Solid-State Reactions between Sn-rich Solder and Ni Substrate", TMS2012, Orlando
• "Reflow and Solid-State Reactions between SnAgCuNi Solder and Au/Pd/Ni Surface Finish", TMS 2012, Orlando